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302299

302299

Micromodul™ connector for direct mating, insulation displacement technology (IDT), with locking on printed circuit board by means of locking hooks and toes, with closed sides
AZ30

AZ30

Pull-off tongs for Micromodul™ connectors
MICA

MICA

Micromodul™ connector for indirect mating, insulation displacement technology (IDT), with lock, loose
MICA VP3

MICA VP3

Micromodul™ connector for indirect mating, insulation displacement technology (IDT), with lock MICA: loose, on reel
MICAL

MICAL

Micromodul™ solder-in connector, insulation displacement technology (IDT), solder contacts dual row staggered
MICALD

MICALD

Micromodul™ solder-in connector, insulation displacement technology (IDT), solder contacts dual row parallel
MICS

MICS

Micromodul™ tab header, upright, with retaining hooks, solder contacts dual row staggered
MICS-D

MICS-D

Micromodul™ tab header, upright, without retaining hooks, solder contacts dual row parallel
MICS/SMD

MICS/SMD

Micromodul™ tab header, upright, in surface mount technology (SMT), solder contacts dual row staggered, with press-fit spigots, in bulk, with retaining hooks
MICS/SMD RP

MICS/SMD RP

Micromodul™ tab header, upright, in surface mount technology (SMT), solder contacts dual row staggered, with press-fit spigots, on reel, with pick-and-place top
MICSW

MICSW

Micromodul™ tab header, angular, solder contacts dual row staggered
Hronovský s.r.o.

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+420 491 445 111
info@hronovsky.cz
sales@hronovsky.cz
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Hronovský s.r.o.
Osma 481
Nové Město nad Metují
549 01
IČ: 26000458
DIČ: CZ26000458
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